From standard multilayer boards to advanced HDI structures with laser microvias, stacked vias, and via-in-pad technology. Precision-engineered for 5G, automotive, aerospace, and high-performance computing.
Advanced material selection and layer stack-up configurations supporting the most demanding high-density interconnect requirements.
| Feature | Standard | Advanced |
|---|---|---|
| Layer Count | Up to 40L | Up to 100L |
| Minimum Core Thickness | 70 µm (2.8 mil) | 50 µm (2.0 mil) |
| Minimum Prepreg Thickness | 60 – 200 µm (2.4 – 7.9 mil) | |
| Base Copper Outer Layer | 12 – 210 µm | 12 – 615 µm |
| Base Copper Inner Layer | 12 – 210 µm | 12 – 420 µm |
| Cu Plating in PTH Via Hole-wall | 20 – 30 µm | 20 – 60 µm |
| PCB Thickness (4L) | 0.6 – 3.2 mm | 0.5 – 8.0 mm |
| PCB Thickness (>10L) | 1.0 – 3.2 mm | 0.8 – 8.0 mm |
Tg 130°C, 150°C, 170°C options for standard and thermal applications.
Optimized for signal integrity in 5G and high-frequency designs.
Hydrocarbon ceramic, BT, GIL, and PTFE for hybrid constructions.
Review, design adjustment, stack-up service, and detailed test reports on final PCBs.
Comprehensive via structuring from standard PTH to advanced stacked and staggered laser microvias.
| Parameter | Description | Standard | Advanced |
|---|---|---|---|
| PTH & Buried Hole | Drill diameter | 0.20 mm (8 mil) | 0.15 mm (6 mil) |
| Finished PTH & Buried | Final hole size | 0.12 mm (5 mil) | 0.07 mm (3 mil) |
| PTH & Buried Pad | Annular ring | Drill + 0.25 mm | Drill + 0.15 mm |
| Microvia Laser Drilled | Laser hole diameter | 0.10 mm (4 mil) | 0.06 mm (2.36 mil) |
| Entry & Capture Pad | Microvia pad size | Drill + 0.15 mm | Drill + 0.12 mm |
| Skip Via Drill | Skip via hole | 0.20 mm (8 mil) | 0.15 mm (6 mil) |
| PTH to PTH | Minimum spacing | 0.30 mm (12 mil) | 0.25 mm (10 mil) |
| PTH to Microvia | Minimum spacing | 0.25 mm (10 mil) | 0.20 mm (8 mil) |
| Microvia to Microvia | Minimum spacing | 0.25 mm (10 mil) | 0.15 mm (6 mil) |
| Microvia Dielectric | Dielectric thickness | 0.06 – 0.08 mm | 0.10 mm (4 mil) |
Expert Note: HDI mostly contains laser drilled vias but can also contain through vias and buried vias. Staggered, stacked, and skip-via configurations are available depending on layer count and density requirements. Copper-filled microvias and filled & capped buried vias are supported for high-reliability applications.
Optimized trace, space, and via strategies for fine-pitch BGA layouts from 0.8 mm down to 0.5 mm pitch.
| Parameter | Standard | Advanced |
|---|---|---|
| BGA Pad | Max 0.40 mm (15.75 mil) | ≥ 0.25 mm (10 mil) |
| Soldermask Opening | Pad + 0.10 mm (4 mil) | Pad + 0.08 mm (3.15 mil) |
| PTH Pad (OL & IL) | 0.45 mm (17.72 mil) | 0.40 mm (15.75 mil) |
| PTH Drill | 0.20 mm (7.87 mil) | |
| Trace & Space (OL & IL) | 0.10 / 0.10 mm (4/4 mil) | 0.075 / 0.075 mm (3/3 mil) |
| Trace to BGA Pad | 0.10 mm (4 mil) | 0.08 mm (3.15 mil) |
BGA pitch 0.8 mm does not require laser vias or buried vias. A conventional dog-bone design with PTH vias is sufficient. The number of layers is determined by the overall size of the BGA and net count.
| Parameter | Standard | Advanced |
|---|---|---|
| BGA Pad | Max 0.35 mm (13.78 mil) | ≥ 0.25 mm (10 mil) |
| Soldermask Opening | Pad + 0.10 mm (4 mil) | Pad + 0.08 mm (3.15 mil) |
| Microvia Pad (OL & IL) | 0.30 mm (11.81 mil) | 0.25 mm (10 mil) |
| Microvia Hole | 0.12 mm (5 mil) | 0.10 mm (4 mil) |
| Trace & Space (OL) | 0.10 / 0.10 mm (4/4 mil) | 0.075 / 0.075 mm (3/3 mil) |
| Trace to BGA Pad | 0.10 mm (4 mil) | 0.08 mm (3.15 mil) |
BGA pitch 0.65 mm can be achieved with dog-bone design using laser drilled micro-vias. The number of layers and the need for buried vias are determined by the size of the BGA.
| Parameter | Standard | Advanced |
|---|---|---|
| Microvia | 0.075 – 0.13 mm (3–5 mil) | 0.075 – 0.15 mm (3–6 mil) |
| BGA Pad & IL Capture Pad | Drill + 0.15 mm (6 mil) | Drill + 0.13 mm (5 mil) |
| Soldermask Opening | Pad + 0.10 mm (4 mil) | Pad + 0.07 mm (2.76 mil) |
| Trace & Space (OL & IL) | 0.10 / 0.10 mm (4/4 mil) | 0.065 / 0.065 mm (2.56/2.56 mil) |
| Trace to BGA Pad | 0.10 mm (4 mil) | 0.065 mm (2.56 mil) |
BGA pitch 0.5 mm requires via-in-pad design with laser drilled micro-vias. Micro-vias in BGA pads must be copper-filled to avoid voids during SMT soldering.
Tight tolerance control across routing, milling, V-cut scoring, back drilling, and countersink operations.
| Contour Tolerance | ±0.1 mm / Adv. ±0.075 |
| Edge to Copper | 0.25 mm / Adv. 0.15 |
| Hole to Hole Position | ±0.1 mm / Adv. ±0.075 |
| Min Tool Diameter | 0.8 mm / Adv. 0.6 |
| Max Panel Dimension | 580 × 1250 mm |
| Contour Tolerance | ±0.1 mm |
| Center to Pattern | 0.25 ±0.05 mm |
| V-Cut Angle | 20° / 30° / 45° / 60° |
| Angle Tolerance | ±2° / Adv. ±5° |
| PCB Thickness Range | 0.6 – 3.0 mm |
| Depth Tolerance | ±0.2 mm / Adv. ±0.1 |
| Min Remaining PTH | 0.4 ±0.2 mm / Adv. 0.2±0.1 |
| Oversize | 0.25 mm / Adv. 0.1 |
| Hole Angle | 90° ±10° / Adv. 30–180° |
| Depth Tolerance | ±0.2 mm / Adv. ±0.1 |
| Min Remaining | 0.4 ±0.2 mm / Adv. 0.2±0.1 |
| Tolerance | ±0.3 mm / Adv. ±0.1 |
IPC-4761 compliant via protection strategies from simple tenting to fully filled and capped structures.
| Type | IPC-4761 Ref | Fill Material | Characteristics |
|---|---|---|---|
| A. Soldermask Tenting | N/A | Liquid soldermask | Most common protection. Risk of exposed Cu in hole over time. |
| B. Via Filling Non-conductive or conductive |
Type V | Soldermask lacquer, epoxy resin, conductive paste | Soldermask ≥70% fill; epoxy/conductive require 100%. Excellent hole-wall protection; prevents solder balls on opposite side. |
| C. Filled + Capped Both sides |
Type VI a&b | Soldermask lacquer, epoxy resin, conductive paste | Same fill requirements as Type V with additional soldermask cap for complete sealing. |
| D. Filled + Copper Capped | Type VII | Epoxy resin, conductive paste | Excellent hole-wall protection. Used for stacked microvias, buried vias, and PTH in SMD pads. |
Multiple RoHS-compliant surface finishes tailored to soldering complexity, wire bonding, and press-fit requirements.
| Surface Finish | Thickness | RoHS | Fine Pitch / BGA | Wire Bonding | Press-Fit |
|---|---|---|---|---|---|
| OSP | 0.2 – 0.6 µm | ✓ | ✓ | — | — |
| Immersion Tin (Sn) | 0.8 – 1.5 µm | ✓ | ✓ | — | Limited |
| Immersion Silver (Ag) | 0.1 – 0.5 µm | ✓ | ✓ | — | ✓ |
| ENIG (Ni/Au) | Ni 3–6 / Au 0.05–0.125 µm | ✓ | ✓ | Alu | Limited |
| ENEPIG (Ni/Pd/Au) | Ni 3–6 / Pd 0.05–0.3 / Au 0.03–0.125 µm | ✓ | ✓ | Alu / Au | ✓ |
| Galvanic Soft Gold | Ni 3–6 / Au 0.05–0.8 µm | ✓ | ✓ | Alu / Au | ✓ |
| Galvanic Hard Gold | Ni 2.5–6 / Au 0.8–1.5 µm | ✓ | ✓ | — | Limited |
Expert Note: ENIG is the most common flat surface suitable for multiple soldering processes of high complexity assemblies. The surface is not so sensitive to time between soldering processes. For applications requiring both wire bonding and press-fit, ENEPIG or Galvanic Soft Gold are recommended.
Our FAE team provides free DFM analysis, stack-up recommendations, and impedance simulation for your high-density designs.