Cost-optimized HDI and flexible printed circuit boards engineered for high-volume consumer electronics. From smartphones to wearables and gaming devices, our consumer-grade PCBs balance performance, cost, and time-to-market.
Four specialized PCB solutions designed for consumer electronics, each optimized for miniaturization, signal integrity, and high-volume manufacturing.
Ultra-high-density interconnect boards for flagship smartphones, tablets, and mobile devices. Features stacked microvias, blind/buried vias, and fine-pitch BGA routing for AP, modem, and memory subsystems.
| Layer Count | 8–14 Layers HDI |
| Material | Mid Tg / Low Dk FR-4 |
| Trace/Space | 2mil / 2mil |
| Min Via | 0.075mm Laser Microvia |
| Impedance Control | ±5% Tolerance |
| Surface Finish | ENIG / ENEPIG |
| Board Thickness | 0.6mm – 1.0mm |
| Certification | RoHS / IPC Class 2 |
Ultra-thin flexible and rigid-flex boards for smartwatches, TWS earbuds, fitness bands, and AR/VR headsets. Enables compact 3D packaging with dynamic flexing and biocompatible material options.
| Type | Flex / Rigid-Flex |
| Material | Polyimide (PI) / PET |
| Layer Count | 2–8 Layers |
| Min Bend Radius | 3× Board Thickness |
| Copper Weight | 1/3oz – 1oz |
| Surface Finish | Immersion Gold / OSP |
| Flex Cycles | ≥100,000 Cycles |
| Certification | RoHS / IPC-6013 |
Compact wireless-enabled boards for smart speakers, home security hubs, connected appliances, and environmental sensors. Integrated antenna design supports Wi-Fi, Bluetooth LE, Zigbee, and Matter protocols.
| Layer Count | 2–6 Layers |
| Material | Standard FR-4 / CEM-3 |
| Trace/Space | 4mil / 4mil |
| Wireless | Wi-Fi / BLE / Zigbee / Matter |
| Antenna | On-board PCB / Ceramic / Stamp |
| Surface Finish | ENIG / HASL Lead-free |
| Operating Temp | 0°C ~ +70°C |
| Certification | RoHS / CE / FCC |
Low-latency control boards for gamepads, gaming keyboards, mice, and VR controllers. Optimized for haptic motor drivers, RGB lighting control, and high-speed USB/Bluetooth communication.
| Layer Count | 2–4 Layers |
| Material | FR-4 / CEM-3 |
| Trace/Space | 4mil / 4mil |
| Surface Finish | ENIG / OSP / HASL |
| Haptics | ERM / LRA Motor Ready |
| Connectivity | USB-C / Bluetooth 5.3 / 2.4GHz |
| RGB Support | Addressable LED Ready |
| Certification | RoHS / CE / FCC |
2mil/2mil traces, 0.075mm microvia
100K+ flex cycles validated
Multi-protocol wireless integration
Gaming-grade response time
Our consumer electronics team delivers cost-optimized designs with fast turnaround for high-volume production.
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